ADSP-BF533SBBC500

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ADSP-BF533SBBC500概述

Blackfin㈢嵌入式处理器 Blackfin㈢ Embedded Processor

GENERAL DESCRIPTION

The ADSP-BF531/ADSP-BF532/ADSP-BF533 processors are members of the Blackfin family of products, incorporating the Analog Devices/Intel Micro Signal Architecture MSA. Black fin processors combine a dual-MAC state-of-the-art signal processing engine, the advantages of a clean, orthogonal RISC like microprocessor instruction set, and single instruction, multiple data SIMD multimedia capabilities into a single instruction set architecture.

FEATURES

Up to 600 MHz high performance Blackfin processor

  Two 16-bit MACs, two 40-bit ALUs, four 8-bit video ALUs, 40-bit shifter

  RISC-like register and instruction model for ease of programming and compiler-friendly support

  Advanced debug, trace, and performance monitoring

0.85 V to 1.30 V core VDD with on-chip voltage regulation

1.8 V, 2.5 V, and 3.3 V compliant I/O

160-ball CSP_BGA, 169-ball PBGA, and 176-lead LQFP packages

MEMORY

Up to 148K bytes of on-chip memory:

   16K bytes of instruction SRAM/Cache

   Up to 64K bytes of instruction SRAM

   Up to32K bytes of data SRAM/Cache

   Up to32K bytes of data SRAM

   4K bytes of scratchpad SRAM

Memory management unit providing memory protection

External memory controller with glueless support for SDRAM, SRAM, flash, and ROM

Flexible memory booting options from SPI® and external memory

PERIPHERALS

Parallel peripheral interface PPI/GPIO, supporting ITU-R 656 video data formats

Two dual-channel, full duplex synchronous serial ports, supporting eight stereo I2S channels

Four memory-to-memory DMAs

Eight peripheral DMAs

SPI-compatible port

Three 32-bit timer/counters with PWM support

Real-time clock and watchdog timer

32-bit core timer

Up to 16 general-purpose I/O pins GPIO

UART with support for IrDA®

Event handler

Debug/JTAG interface

On-chip PLL capable of 0.5� to 64� frequency multiplication

ADSP-BF533SBBC500中文资料参数规格
技术参数

频率 500 MHz

RAM大小 148 KB

UART数量 1

工作温度Max 85 ℃

工作温度Min -40 ℃

封装参数

安装方式 Surface Mount

引脚数 160

封装 CSP-BGA

外形尺寸

长度 12 mm

宽度 12 mm

高度 1.21 mm

封装 CSP-BGA

物理参数

工作温度 -40℃ ~ 85℃ TA

其他

产品生命周期 Active

包装方式 Tray

符合标准

RoHS标准 Non-Compliant

含铅标准 Contains Lead

海关信息

ECCN代码 3A991

香港进出口证 NLR

数据手册

ADSP-BF533SBBC500引脚图与封装图
ADSP-BF533SBBC500引脚图
ADSP-BF533SBBC500封装图
ADSP-BF533SBBC500封装焊盘图
在线购买ADSP-BF533SBBC500
型号: ADSP-BF533SBBC500
制造商: ADI 亚德诺
描述:Blackfin㈢嵌入式处理器 Blackfin㈢ Embedded Processor
替代型号ADSP-BF533SBBC500
型号/品牌 代替类型 替代型号对比

ADSP-BF533SBBC500

ADI 亚德诺

当前型号

当前型号

ADSP-BF533SBBCZ500

亚德诺

完全替代

ADSP-BF533SBBC500和ADSP-BF533SBBCZ500的区别

ADSP-BF533SBBC-5V

亚德诺

完全替代

ADSP-BF533SBBC500和ADSP-BF533SBBC-5V的区别

ADSP-BF533SBBZ500

亚德诺

类似代替

ADSP-BF533SBBC500和ADSP-BF533SBBZ500的区别

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