AT24C32E-UUM0B-T中文资料参数规格
封装参数
封装 XFBGA-5
外形尺寸
封装 XFBGA-5
其他
Series -
Packaging Digi-ReelR Alternate Packaging
Package-Case 5-XFBGA, WLCSP
Operating-Temperature -40°C ~ 85°C TC
Interface I2C, 2-Wire Serial
Voltage-Supply 1.7 V ~ 3.6 V
Supplier-Device-Package 5-WLCSP 3x3
Memory-Size 32K 4K x 8
Memory-Type EEPROM
Speed 400kHz, 1MHz
Format-Memory EEPROMs - Serial
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