A3PE3000-1FG896

A3PE3000-1FG896概述

ProASIC3E闪存系列FPGA具有可选的软ARM支持 ProASIC3E Flash Family FPGAs with Optional Soft ARM Support

Features and Benefits

High Capacity

• 600 k to 3 Million System Gates

• 108 to 504 kbits of True Dual-Port SRAM

• Up to 620 User I/Os

Reprogrammable Flash Technology

• 130-nm, 7-Layer Metal 6 Copper, Flash-Based CMOS Process

• Instant On Level 0 Support

• Single-Chip Solution

• Retains Programmed Design when Powered Off

On-Chip User Nonvolatile Memory

• 1 kbit of FlashROM with Synchronous Interfacing

High Performance

• 350 MHz System Performance

• 3.3 V, 66 MHz 64-Bit PCI

In-System Programming ISP and Security

• ISP Using On-Chip 128-Bit Advanced Encryption Standard AES Decryption via JTAG IEEE 1532–compliant

• FlashLock® Designed to Secure FPGA Contents

Low Power

• Core Voltage for Low Power

• Support for 1.5-V-Only Systems

• Low-Impedance Flash Switches

High-Performance Routing Hierarchy

• Segmented, Hierarchical Routing and Clock Structure

• Ultra-Fast Local and Long-Line Network

• Enhanced High-Speed, Very-Long-Line Network

• High-Performance, Low-Skew Global Network

• Architecture Supports Ultra-High Utilization

Pro Professional I/O

• 700 Mbps DDR, LVDS-Capable I/Os

• 1.5 V, 1.8 V, 2.5 V, and 3.3 V Mixed-Voltage Operation

• Bank-Selectable I/O Voltages—up to 8 Banks per Chip

• Single-Ended I/O Standards: LVTTL, LVCMOS 3.3 V /2.5 V / 1.8 V / 1.5 V, 3.3 V PCI / 3.3 V PCI-X, and LVCMOS

2.5 V / 5.0 V Input

• Differential I/O Standards: LVPECL, LVDS, B-LVDS, and M-LVDS

• Voltage-Referenced I/O Standards: GTL+ 2.5 V / 3.3 V, GTL 2.5 V / 3.3 V, HSTL Class I and II, SSTL2 Class I and II, SSTL3 Class I and II

• I/O Registers on Input, Output, and Enable Paths

• Hot-Swappable and Cold Sparing I/Os

• Programmable Output Slew Rate and Drive Strength

• Programmable Input Delay

• Schmitt Trigger Option on Single-Ended Inputs

• Weak Pull-Up/-Down

• IEEE 1149.1 JTAG Boundary Scan Test

• Pin-Compatible Packages across the ProASIC®3E Family

Clock Conditioning Circuit CCC and PLL

• Six CCC Blocks, Each with an Integrated PLL

• Configurable Phase-Shift, Multiply/Divide, Delay Capabilities and External Feedback

• Wide Input Frequency Range 1.5 MHz to 350 MHz

SRAMs and FIFOs

• Variable-Aspect-Ratio 4,608-Bit RAM Blocks ×1, ×2, ×4, ×9, and ×18 organizations available

• True Dual-Port SRAM except ×18

• 24 SRAM and FIFO Configurations with Synchronous Operation up to 350 MHz

ARM® Processor Support in ProASIC3E FPGAs

• M1 ProASIC3E Devices—Cortex-M1 Soft Processor Available

with or without Debug

A3PE3000-1FG896中文资料参数规格
技术参数

工作温度Max 70 ℃

工作温度Min 0 ℃

电源电压 1.425V ~ 1.575V

封装参数

安装方式 Surface Mount

引脚数 896

封装 FBGA-896

外形尺寸

长度 31 mm

宽度 31 mm

高度 1.73 mm

封装 FBGA-896

物理参数

工作温度 0℃ ~ 85℃ TJ

其他

产品生命周期 Active

包装方式 Tray

符合标准

RoHS标准 Non-Compliant

含铅标准

数据手册

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型号: A3PE3000-1FG896
描述:ProASIC3E闪存系列FPGA具有可选的软ARM支持 ProASIC3E Flash Family FPGAs with Optional Soft ARM Support
替代型号A3PE3000-1FG896
型号/品牌 代替类型 替代型号对比

A3PE3000-1FG896

Microsemi 美高森美

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当前型号

A3PE3000-FG896

美高森美

完全替代

A3PE3000-1FG896和A3PE3000-FG896的区别

A3PE3000-FGG896

美高森美

完全替代

A3PE3000-1FG896和A3PE3000-FGG896的区别

A3PE3000-FG896I

美高森美

类似代替

A3PE3000-1FG896和A3PE3000-FG896I的区别

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