APH-127-10-25-S

EUROPEAN THERMODYNAMICS  APH-127-10-25-S  冷却模块, 热点/Peltier, 密封, 单级

The is a Thermoelectric Peltier Cooler Module built with high temperature solder with the ability to withstand <200°C assembly processing. Single-stage modules can create systems which are effective from a few mW to few hundred Watts of cooling power. This type of module can be bonded using heat sink bonder temperatures for short periods of time.

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Sealed and lapped for multi-module applications

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Solid-state reliability

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High strength for rugged environments

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High integrity nickel diffusion barriers on elements

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Max delta T performance up to 76°C

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Porched style for enhanced lead wire strength

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Bespoke designs available