AGP30

CIF  AGP30  原型电路板, 垫, 环氧玻璃复合, 1.57mm, 160mm x 300mm

The is a 160 x 300mm single sided Prototyping Board features tinned copper clad pads with drilled at 2.54mm pitch. Drilling diameter is 1mm, width of tracks 2mm over the whole surface. Gap of 0.54mm over the whole surface.

欧时:
铜镀锡方形垫卡单面铜镀锡方形垫卡。 2.54 mm 钻孔节距。 轨道之间的间隙为 0.54 mm。 方形垫 2 mm x 2 mm。 材料： | 环氧玻璃 ---|--- 厚度： | 1.6 mm 孔直径： | 1 mm ### 条紋板 - 矩阵板

e络盟:
CIF  AGP30  原型电路板, 垫, 环氧玻璃复合, 1.57mm, 160mm x 300mm

Newark:
# CIF  AGP30  Protoboard, Pad, Epoxy Glass Composite, 1.57mm, 160mm x 300mm