A15324-01

LAIRD TECHNOLOGIES  A15324-01  热缝隙填充, 229 X 229MM, 1MM

The is a 1mm Thermal Gap Filler with unique silicone gel offers compliancy and thermal resistance at pressures of 50psi will deflect to over 50% the original thickness. This high rate of compliancy allows the material to totally blanket the component, enhancing thermal transfer. The material has a very low compression set enabling the pad to be reused many times. Tflex™ 300, in achieving its stellar compliancy, does not sacrifice thermal performance. With a thermal conductivity of 1.2W/mK, low thermal resistances can be achieved at low pressures. Tflex™ 300-H is offered with a hard, metalized liner option for easy handling and improved rework. The metalized liner"s lower coefficient of friction also allows for easy assembly of parts that must slide together, such as a card into a chassis. It is suitable for flat panel displays, memory modules, set top box, lighting ballast, handheld electronics, optical disk drives and vibration dampening applications.

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Extreme compliancy allows material to totally blanket components

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Low compression set enables the pad to be reused many times

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UL94V-0 Flammability rating

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-40 to 160°C Operating temperature

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±10% Thickness tolerance

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0.56% Out-gassing TML

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0.10% Out-gassing CVCM

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600ppm/c Coefficient thermal expansion CTE