DRAM Chip DDR2 SDRAM 512M-Bit 32Mx16 1.8V 84Pin FBGA
The 512Mb DDR2 SDRAM is organized as a 32Mbit x 4 I/Os x 4 banks, 16Mbit x 8 I/Os x 4banks or 8Mbit x 16 I/Os x 4 banks device. This synchronous device achieves high speed double data-rate transfer rates of up to 800Mb/sec/pin DDR2-800 for general applications.
The chip is designed to comply with the following key DDR2 SDRAM features such as posted CAS with additive latency, write latency = read latency -1, Off-Chip DriverOCD impedance adjustment and On Die Termination.
Key Features
• JEDEC standard 1.8V ± 0.1V Power Supply
• VDDQ = 1.8V ± 0.1V
• 200 MHz fCK for 400Mb/sec/pin, 267MHz fCK for 533Mb/sec/pin, 333MHz fCK for 667Mb/sec/pin, 400MHz fCK for 800Mb/sec/pin
• 4 Banks
• Posted CAS
• Programmable CAS Latency: 3, 4, 5, 6
• Programmable Additive Latency: 0, 1 , 2 , 3, 4 , 5
• Write LatencyWL = Read LatencyRL -1
• Burst Length: 4 , 8Interleave/nibble sequential
• Programmable Sequential / Interleave Burst Mode
• Bi-directional Differential Data-Strobe Single-ended data strobe is an optional feature
• Off-Chip DriverOCD Impedance Adjustment
• On Die Termination
• Special Function Support
-PASRPartial Array Self Refresh
-50ohm ODT
-High Temperature Self-Refresh rate enable
• Average Refresh Period 7.8us at lower than TCASE 85°C, 3.9us at 85°C < T CASE < 95 °C
• All of Lead-free products are compliant for RoHS