LSM6DS3US 系列 3.6 V 3D 数字加速度计 & 3D 数字陀螺仪 - LGA-14L
The LSM6DS3US is a system-in-package featuring a 3D digital accelerometer and a 3D digital gyroscope performing at 1.1 mA up to 1.6 kHz ODR in high-performance mode and enabling always-on low-power features for an optimal motion experience for the consumer.
The LSM6DS3US supports main OS requirements, offering real, virtual and batch sensors with 4 kbyte FIFO + flexible 4 kbyte FIFO or programmable for dynamic data batching.
The LSM6DS3US gyroscope supports both OIS/EIS applications. The device can be connected to the camera module through a dedicated auxiliary SPI Mode 3 while flexibility for the primary interface is available I2C/SPI.
ST’s family of MEMS sensor modules leverages the robust and mature manufacturing processes already used for the production of micromachined accelerometers and gyroscopes.
The various sensing elements are manufactured using specialized micromachining processes, while the IC interfaces are developed using CMOS technology that allows the design of a dedicated circuit which is trimmed to better match the characteristics of the sensing element.
The LSM6DS3US has a full-scale acceleration range of ±2/±4/±8/±16 g and an angular rate range of ±125/±250/±500/±1000/±2000 dps.
High robustness to mechanical shock makes the LSM6DS3US the preferred choice of system designers for the creation and manufacturing of reliable products.
The LSM6DS3US is available in a plastic land grid array LGA package.
**Key Features**
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- Power consumption: 0.85 mA in combo normal mode and 1.1 mA in combo high-performance mode up to 1.6 kHz.
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- “Always-on” experience with low power consumption for both accelerometer and gyroscope
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- Interface flexibility: selectable SPI 3/4-wire or I2 C with the main processor
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- Auxiliary SPI 3-wire to support OIS applications
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- EIS/OIS support
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- Accelerometer ODR up to 6.66 kHz
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- Gyroscope ODR up to 3.33 kHz
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- Smart FIFO
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- ±2/±4/±8/±16 g full scale
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- ±125/±250/±500/±1000/±2000 dps full scale
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- Analog supply voltage: 1.71 V to 3.6 V
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- Independent IOs supply 1.62 V
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- Compact footprint, 2.5 mm x 3 mm x 0.83 mm
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- SPI/I2 C serial interface data synchronization feature
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- Embedded temperature sensor
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- ECOPACK® , RoHS and “Green” compliant