LCMXO2-7000HE-4BG332I

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LCMXO2-7000HE-4BG332I概述

IC CPLD 3432MC 7.24NS 332CSBGA

Features

Flexible Logic Architecture

 • Six devices with 256 to 6864 LUT4s and  19 to 335 I/Os

Ultra Low Power Devices

  • Advanced 65 nm low power process

  • As low as 19 µW standby power

  • Programmable low swing differential I/Os

  • Stand-by mode and other power saving options

Embedded and Distributed Memory

  • Up to 240 Kbits sysMEM™ Embedded Block RAM

  • Up to 54 Kbits Distributed RAM

  • Dedicated FIFO control logic  On-Chip User Flash Memory

  • Up to 256 Kbits of User Flash Memory

  • 100,000 write cycles

  • Accessible through WISHBONE, SPI, I2C and JTAG interfaces

  • Can be used as soft processor PROM or as Flash memory

Pre-Engineered Source Synchronous I/O

  • DDR registers in I/O cells

  • Dedicated gearing logic

  • 7:1 Gearing for Display I/Os

  • Generic DDR, DDRX2, DDRX4

  • Dedicated DDR/DDR2/LPDDR memory with DQS support

High Performance, Flexible I/O Buffer

  • Programmable sysIO™ buffer supports wide range of interfaces:

   – LVCMOS 3.3/2.5/1.8/1.5/1.2

   – LVTTL

   –PCI

   – LVDS, Bus-LVDS, MLVDS, RSDS, LVPECL

   – SSTL 25/18

   – HSTL 18

   – Schmitt trigger inputs, up to 0.5V hysteresis

  • I/Os support hot socketing

  • On-chip differential termination

  • Programmable pull-up or pull-down mode

LCMXO2-7000HE-4BG332I中文资料参数规格
技术参数

工作温度Max 100 ℃

工作温度Min -40 ℃

电源电压 1.14V ~ 1.26V

封装参数

安装方式 Surface Mount

引脚数 332

封装 FBGA-332

外形尺寸

封装 FBGA-332

物理参数

工作温度 -40℃ ~ 100℃ TJ

其他

产品生命周期 Active

包装方式 Tray

符合标准

RoHS标准 RoHS Compliant

含铅标准 Lead Free

数据手册

LCMXO2-7000HE-4BG332I引脚图与封装图
LCMXO2-7000HE-4BG332I引脚图
LCMXO2-7000HE-4BG332I封装图
LCMXO2-7000HE-4BG332I封装焊盘图
在线购买LCMXO2-7000HE-4BG332I
型号: LCMXO2-7000HE-4BG332I
描述:IC CPLD 3432MC 7.24NS 332CSBGA

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