MLG1608B3N3S

TDK  MLG1608B3N3S  表面贴装高频电感器, MLG系列, 3.3 nH, ± 0.3nH, 0603 [1608 公制], 6.5 GHz, 0.12 ohm

Inductor High Frequency Chip Unshielded Multi-Layer 3.3nH 0.3nH 100MHz 10Q-Factor Ceramic 600mA 120mOhm DCR 0603 T/R

e络盟:
高频电感器, 3.3 nH, MLG系列, 600 mA, 0603 [1608 公制], 多层, 0.12 ohm

艾睿:
Inductor High Frequency Chip Unshielded Multi-Layer 3.3nH 0.3nH 100MHz 10Q-Factor Ceramic 600mA 120mOhm DCR 0603 T/R

Chip1Stop:
Ind High Frequency Chip Unshielded Multi-Layer 3.3nH 0.3nH 100MHz 10Q-Factor Ceramic 600mA 0603

TME:
Inductor: ceramic; SMD; 0603; 3.3nH; 600mA; 60mΩ; ftest:100MHz; Q:10

Verical:
Inductor High Frequency Chip Unshielded Multi-Layer 0.0033uH 0.3nH 100MHz 10Q-Factor Ceramic 0.6A 0.12Ohm DCR 0603 T/R

MASTER:
Inductor High Frequency Chip Unshielded Multi-Layer 3.3nH 0.3nH 100MHz 10Q-Factor Ceramic 600mA 120mOhm DCR 0603 T/R

Electro Sonic:
Inductor High Frequency Chip Unshielded Multi-Layer 3.3nH 0.3nH 100MHz 10Q-Factor Ceramic 600mA 120mOhm DCR 0603 T/R