MLG1005S6N2S

TDK  MLG1005S6N2S  表面贴装高频电感器, MLG系列, 6.2 nH, ± 0.3nH, 0402 [1005 公制], 4 GHz, 0.25 ohm

Inductor High Frequency Chip Unshielded Multi-Layer 6.2nH 0.3nH 100MHz 8Q-Factor Ceramic 600mA 250mOhm DCR 0402 T/R

e络盟:
高频电感器, 6.2 nH, MLG系列, 600 mA, 0402 [1005 公制], 多层, 0.25 ohm

艾睿:
Inductor High Frequency Chip Unshielded Multi-Layer 6.2nH 0.3nH 100MHz 8Q-Factor Ceramic 600mA 250mOhm DCR 0402 T/R

安富利:
Ind High Frequency Chip Unshielded Multi-Layer 6.2nH 0.3nH 100MHz 8Q-Factor Ceramic 600mA 0402

Chip1Stop:
Ind High Frequency Chip Unshielded Multi-Layer 6.2nH 0.3nH 100MHz 8Q-Factor Ceramic 600mA 0402

TME:
Inductor: ceramic; SMD; 0402; 6.2nH; 600mA; 160mΩ; Q:8; ftest:100MHz

Newark:
# TDK  MLG1005S6N2S  Surface Mount High Frequency Inductor, MLG Series, 6.2 nH, 600 mA, 0402 [1005 Metric], Multilayer

MASTER:
Inductor High Frequency Chip Unshielded Multi-Layer 6.2nH 0.3nH 100MHz 8Q-Factor Ceramic 600mA 250mOhm DCR 0402 T/R

Electro Sonic:
Inductor High Frequency Chip Unshielded Multi-Layer 6.2nH 0.3nH 100MHz 8Q-Factor Ceramic 600mA 250mOhm DCR 0402 T/R