MFU0603FF03500P100

MFU0603FF03500P100图片1
MFU0603FF03500P100图片2
MFU0603FF03500P100图片3
MFU0603FF03500P100图片4
MFU0603FF03500P100概述

Fuse Chip Very Fast Acting 3.5A 63V SMD Solder Pad 0603 Ceramic T/R

MFU Thin Film Flat Chip Fuses are the perfect choice for most fields of modern electronics. The highly controlled thin film manufacturing process guarantees an outstanding stability of fusing characteristics. Typical applications include information technology, telecommunications, medical equipment and audio/video electronics.

** Features**

* Advanced Thin Film Technology

* Very Quick Acting Fuse Characteristics

* Outstanding Stability of Fusing Characteristics

* Standard Metric SMD Sizes

* Green Product, Supports Lead Pb-Free Soldering

MFU0603FF03500P100中文资料参数规格
技术参数

额定电压DC 32 V

额定电流 3.5 A

额定电压 32 VDC

封装参数

安装方式 Surface Mount

封装公制 1608

封装 0603

外形尺寸

长度 1.55 mm

宽度 850 µm

高度 0.45 mm

封装公制 1608

封装 0603

物理参数

工作温度 -55℃ ~ 125℃

其他

包装方式 Tape & Reel TR

符合标准

RoHS标准 RoHS Compliant

含铅标准 Lead Free

REACH SVHC标准 No SVHC

数据手册

在线购买MFU0603FF03500P100
型号: MFU0603FF03500P100
制造商: Vishay Semiconductor 威世
描述:Fuse Chip Very Fast Acting 3.5A 63V SMD Solder Pad 0603 Ceramic T/R

锐单商城 - 一站式电子元器件采购平台