MLG1608B22NJ

MLG 系列 0603 22 nH ±5 % 500 mA 表面贴装 高频率 多层 电感

Inductor High Frequency Chip Unshielded Multi-Layer 22nH 5% 100MHz 12Q-Factor Ceramic 500mA 350mOhm DCR 0603 T/R

艾睿:
Inductor High Frequency Chip Unshielded Multi-Layer 22nH 5% 100MHz 12Q-Factor Ceramic 500mA 350mOhm DCR 0603 T/R

安富利:
Ind High Frequency Chip Unshielded Multi-Layer 22nH 5% 100MHz 12Q-Factor Ceramic 500mA 0603

富昌:
MLG 系列 0603 22 nH ±5 % 500 mA 表面贴装 高频率 多层 电感

Chip1Stop:
Ind High Frequency Chip Unshielded Multi-Layer 22nH 5% 100MHz 12Q-Factor Ceramic 500mA 0603

TME:
Inductor: ceramic; SMD; 0603; 22nH; 500mA; 190mΩ; ftest:100MHz; Q:12

Verical:
Inductor High Frequency Chip Unshielded Multi-Layer 0.022uH 5% 100MHz 12Q-Factor Ceramic 0.5A 0.35Ohm DCR 0603 T/R

Newark:
# TDK  MLG1608B22NJ  Surface Mount High Frequency Inductor, MLG Series, 22 nH, 500 mA, 0603 [1608 Metric], Multilayer

MASTER:
Inductor High Frequency Chip Unshielded Multi-Layer 22nH 5% 100MHz 12Q-Factor Ceramic 500mA 350mOhm DCR 0603 T/R

Online Components:
Inductor High Frequency Chip Unshielded Multi-Layer 22nH 5% 100MHz 12Q-Factor Ceramic 500mA 350mOhm DCR 0603 T/R

Electro Sonic:
Inductor High Frequency Chip Unshielded Multi-Layer 22nH 5% 100MHz 12Q-Factor Ceramic 500mA 350mOhm DCR 0603 T/R