MCIMX6S4AVM08AB

MPU i.MX 6 RISC 32Bit 800MHz 1.8V/2.5V/2.8V/3.15V 624Pin MAPBGA Tray

Overview

The i.MX 6 series of applications processors combines scalable platforms with broad levels of integration and power-efficient processing capabilities particularly suited to multimedia applications. The i.MX 6Solo processor features:

* Enhanced capabilities of high-tier portable applications by fulfilling MIPS needs of operations systems and games

* Multilevel memory system

* Smart speed technology that enables the designer to deliver a feature-rich product, requiring levels of power far lower than industry expectations

* Dynamic voltage and frequency scaling

* Powerful graphics acceleration

* Interface flexibility

* Integrated power management throughout the device

* Advanced hardware-enabled security

The i.MX 6Solo is supported by companion power management ICs PMIC MMPF0100, MMPF0200 and PF3001.

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## Features

### CPU Complex

* 1x ARM® Cortex™-A9 up to 1 GHz

* 512 KB L2 cache

* 32 KB instruction and data caches

* NEON SIMD media accelerator

### Multimedia

* GPU 3D

* Vivante GC880

* 35Mtri/s 266Mpxl/s Open GL ES 2.0

* GPU 2DVector Graphics

* Emulated on GPU 3D

* GPU 2DComposition

* Vivante GC320

* 600Mpxl/s, BLIT

* Video Decode

* 1080p30 + D1

* Video Encode

* 1080p30 H.264 BP/ Dual 720p encode

* Camera Interface

* Types: 1x 20-bit parallel, MIPI-CSI2 2 lanes

### Memory

* DDR

* 32 bit LP-DDR3/LV-DDR3

* NAND

* SLC/MLC, 40-bit ECC, ONFI2.2, DDR

### Connectivity

* Automotive

* FlexCAN

* MLB

* Four USB2.0

* 1x HS OTG + PHY

* 1x Host + PHY

* 2x Host USB HSIC

* Ethernet

* 1 Gbps + IEEE®1588

* Expansion Ports

* 3x SD/MMC 4.4, 1x SDXC

* 4x SPI, 5x UART, 3x I²C

* MIPI-HSI

* PCIe 2.0 1 lane

### Display

* 2 x WXGA 1366x786

* EPDC, LVDS, Parallel, MIPI-DSI

### Advanced Power Management

* PMU integration

* ® PF100 power management unit

### Security

Advanced security supporting:

* High Assurance Boot

* Cryptographic cipher engines

* Random number generator

* Tamper detection

### Package and Temperature

* 21 x 21 mm 0.8 mm BGA

* Consumer 0C to +95C, up to 1 GHz

* Industrial -40C to +105C, up to 800 MHz

* Automotive -40C to +125C, AEC-Q100, up to 800 MHz GHz