MPC8555ECVTALF

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MPC8555ECVTALF概述

MPU PowerQUICC III MPC85xx Processor RISC 32Bit 667MHz 2.5V/3.3V 783Pin FCBGA Tray

Overview

Our MPC8555E PowerQUICC® III host processor integrates a wide range of advanced ® technologies, modular cores and peripherals. Leveraging Our system-on-chip SoC PowerQUICC III platform architecture, the MPC8555E combines the powerful e500 core and communications peripheral technology to balance processor performance with I/O system throughput. The processor is designed to offer clock speeds scaling from 533 MHz to 1 GHz.

Access to the errata document for this device requires an NDA. Contact your local NXP Sales Office or NXP Authorized Distributor.

All products on this page are Not Recommended for New Designs.

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## Features

* Communications processor module for peripheral processing tasks

* Integrated security engine

* Multiple-PCI interface support

* High-performance e500 core

* Lower power consumption

* Flexible SoC platform for fast time to market

* Simplified board design

* This product is included in NXP®.s product longevity program, with assured supply for a minimum of 10 years after launch

## Features

MPC8555ECVTALF中文资料参数规格
技术参数

频率 667 MHz

电源电压DC 1.20 V

无卤素状态 Halogen Free

位数 32

工作温度Max 105 ℃

工作温度Min -40 ℃

封装参数

安装方式 Surface Mount

引脚数 783

封装 FCBGA-783

外形尺寸

封装 FCBGA-783

物理参数

工作温度 -40℃ ~ 105℃ TA

其他

产品生命周期 Not Recommended for New Designs

包装方式 Tray

符合标准

RoHS标准

含铅标准 Lead Free

海关信息

ECCN代码 5A002.a.1

数据手册

在线购买MPC8555ECVTALF
型号: MPC8555ECVTALF
制造商: NXP 恩智浦
描述:MPU PowerQUICC III MPC85xx Processor RISC 32Bit 667MHz 2.5V/3.3V 783Pin FCBGA Tray
替代型号MPC8555ECVTALF
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MPC8555ECVTALF

NXP 恩智浦

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当前型号

MPC8541ECVTALF

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MPC8541VTALF

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