NXP OM13086 云连接套件, LPC43S67和A70CM
The is a LPC43S67 and A70CM Cloud Connectivity Kit provides a complete hardware and software platform for developers to evaluate and prototype with the LPC43S6x processor family in cloud connected applications based on IEEE802.11b/g wireless connectivity. The cloud connectivity kit gives developers everything they need to easily create, deploy and manage connected products utilizing Wi-Fi and cloud services, without the need for deep expertise in security, Wi-Fi stacks, device commissioning and cloud service APIs. It enables product companies to realize new, recurring business models with premium product features and services. Based on the LPC43S6x microcontroller and A70CM secure element, the kit combines hardware from and Murata with the Zentri secure connected product platform to support all three key aspects of developing an IoT product of security and connectivity of the physical device, including cloud-based device management for provisioning and remote management.