OMAP3530DZCBB

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OMAP3530DZCBB概述

OMAP3525 - HiRel它和OMAP3530 - HiRel它应用处理器 OMAP3525-HiRel and OMAP3530-HiRel Applications Processors

Description

OMAP3525 and OMAP3530 high-performance, applications processors are based on the enhanced OMAP™ 3 architecture.

The OMAP™ 3 architecture is designed to provide best-in-class video, image, and graphics processing sufficient to support the following:

• Streaming video

• 3D mobile gaming

• Video conferencing

• High-resolution still image

The device supports high-level operating systems OSs, such as:

• Linux

• Windows CE

This OMAP device includes state-of-the-art power-management techniques required for high-performance mobile products.

Features

• OMAP325 and OMAP3530 Applications Processor:

   – OMAP™ 3 Architecture

   – MPU Subsystem

      • Up to 600-MHz ARM Cortex™-A8 Core

      • NEON™ SIMD Coprocessor

   – High Performance Image, Video, Audio IVA2.2™ Accelerator Subsystem

      • Up to 520-MHz TMS320C64x+™ DSP Core

      • Enhanced Direct Memory Access EDMA Controller 128 Independent Channels

      • Video Hardware Accelerators

   – POWERVR SGX™ Graphics Accelerator OMAP3530 Device Only

      • Tile Based Architecture Delivering up to 10 MPoly/sec

      • Universal Scalable Shader Engine: Multi-threaded Engine Incorporating Pixel and Vertex Shader Functionality

      • Industry Standard API Support: OpenGLES 1.1 and 2.0, OpenVG1.0

      • Fine Grained Task Switching, Load Balancing, and Power Management

      • Programmable High Quality Image Anti-Aliasing

   – Fully Software-Compatible With C64x and ARM9™

   – Commercial and Extended Temperature Grades

• Advanced Very-Long-Instruction-Word VLIW TMS320C64x+™ DSP Core

   – Eight Highly Independent Functional Units

      • +Six ALUs 32-/40-Bit, Each Supports Single 32-Bit, Dual 16-Bit, or Quad 8-Bit Arithmetic per Clock Cycle

      • Two Multipliers Support Four 16 x 16-Bit Multiplies 32-Bit Results per Clock Cycle or Eight 8 x 8-Bit Multiplies 16-Bit Results per Clock Cycle

   – Load-Store Architecture With Non-Aligned Support

   – 64 32-Bit General-Purpose Registers

   – Instruction Packing Reduces Code Size

   – All Instructions Conditional

   – Additional C64x+™ Enhancements

      • Protected Mode Operation

      • Exceptions Support for Error Detection and Program Redirection

      • Hardware Support for Modulo Loop Operation

• C64x+ L1/L2 Memory Architecture

   – 32K-Byte L1P Program RAM/Cache Direct Mapped

   – 80K-Byte L1D Data RAM/Cache 2-Way Set-Associative

   – 64K-Byte L2 Unified Mapped RAM/Cache 4-Way Set-Associative

   – 32K-Byte L2 Shared SRAM and 16K-Byte L2 ROM

• C64x+ Instruction Set Features

   – Byte-Addressable 8-/16-/32-/64-Bit Data

   – 8-Bit Overflow Protection

   – Bit-Field Extract, Set, Clear

   – Normalization, Saturation. Bit-Counting

   – Compact 16-Bit Instructions

   – Additional Instructions to Support Complex Multiplies

• ARM Cortex™-A8 Core

   – ARMv7 Architecture

      • Trust Zone®

      • Thumb®-2

      • MMU Enhancements

   – In-Order, Dual-Issue, Superscalar Microprocessor Core

   – NEON™ Multimedia Architecture

   – Over 2x Performance of ARMv6 SIMD

   – Supports Both Integer and Floating Point SIMD

   – Jazelle® RCT Execution Environment Architecture

   – Dynamic Branch Prediction with Branch Target Address Cache, Global History Buffer, and 8-Entry Return Stack

   – Embedded Trace Macrocell ETM Support for Non-Invasive Debug

• Applications:

   – Portable Navigation Devices

   – Portable Media Player

   – Advanced Portable Consumer Electronics

   – Digital TV

   – Digital Video Camera

   – Portable Data Collection

   – Point-of-Sale Devices

   – Gaming

   – Web Tablet

   – Smart White Goods

   – Smart Home Controllers

   – Ultra Mobile Devices

OMAP3530DZCBB中文资料参数规格
技术参数

频率 430 MHz

时钟频率 430 MHz

RAM大小 64 KB

UART数量 3

工作温度Max 90 ℃

工作温度Min 0 ℃

封装参数

安装方式 Surface Mount

引脚数 515

封装 FCBGA-515

外形尺寸

高度 0.68 mm

封装 FCBGA-515

物理参数

工作温度 0℃ ~ 90℃ TJ

其他

产品生命周期 Active

包装方式 Tray

符合标准

RoHS标准 Non-Compliant

含铅标准 Contains Lead

海关信息

香港进出口证 NLR

数据手册

OMAP3530DZCBB引脚图与封装图
OMAP3530DZCBB引脚图
OMAP3530DZCBB封装图
OMAP3530DZCBB封装焊盘图
在线购买OMAP3530DZCBB
型号: OMAP3530DZCBB
制造商: TI 德州仪器
描述:OMAP3525 - HiRel它和OMAP3530 - HiRel它应用处理器 OMAP3525-HiRel and OMAP3530-HiRel Applications Processors

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