OMAP3503DCBB

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OMAP3503DCBB概述

处理器 - 专门应用 Applications Proc

Description

OMAP3515 and OMAP3503 devices are based on the enhanced OMAP 3 architecture.

The OMAP 3 architecture is designed to provide best-in-class video, image, and graphics processing sufficient to support the following:

• Streaming video

• Video conferencing

• High-resolution still image

The device supports high-level operating systems HLOSs, such as:

• Linux®

• Windows® CE

• Android™

This OMAP device includes state-of-the-art power-management techniques required for high-performance mobile products.

The following subsystems are part of the device:

• Microprocessor unit MPU subsystem based on the ARM Cortex-A8 microprocessor

• PowerVR SGX subsystem for 3D graphics acceleration to support display OMAP3515 device only

• Camera image signal processor ISP that supports multiple formats and interfacing options connected to a wide variety of image sensors

• Display subsystem with a wide variety of features for multiple concurrent image manipulation, and a programmable interface supporting a wide variety of displays. The display subsystem also supports NTSC and PAL video out.

• Level 3 L3 and level 4 L4 interconnects that provide high-bandwidth data transfers for multiple initiators to the internal and external memory controllers and to on-chip peripherals

The device also offers:

• A comprehensive power- and clock-management scheme that enables high-performance, low-power operation, and ultralow-power standby features. The device also supports SmartReflex adaptative voltage control. This power-management technique for automatic control of the operating voltage of a module reduces the active power consumption.

• Memory-stacking feature using the package-on-package POP implementation CBB and CBC

packages only

OMAP3503DCBB中文资料参数规格
技术参数

电源电压DC 1.35V max

时钟频率 600 MHz

RAM大小 64 KB

位数 32

UART数量 3

工作温度Max 90 ℃

工作温度Min 0 ℃

电源电压Max 1.35 V

封装参数

安装方式 Surface Mount

引脚数 515

封装 FCBGA-515

外形尺寸

封装 FCBGA-515

物理参数

工作温度 0℃ ~ 90℃ TJ

其他

产品生命周期 Obsolete

包装方式 Tray

符合标准

RoHS标准 RoHS Compliant

含铅标准 Lead Free

REACH SVHC标准 No SVHC

REACH SVHC版本 2015/06/15

海关信息

香港进出口证 NLR

数据手册

OMAP3503DCBB引脚图与封装图
OMAP3503DCBB引脚图
OMAP3503DCBB封装图
OMAP3503DCBB封装焊盘图
在线购买OMAP3503DCBB
型号: OMAP3503DCBB
制造商: TI 德州仪器
描述:处理器 - 专门应用 Applications Proc
替代型号OMAP3503DCBB
型号/品牌 代替类型 替代型号对比

OMAP3503DCBB

TI 德州仪器

当前型号

当前型号

OMAP3503ECBB

德州仪器

完全替代

OMAP3503DCBB和OMAP3503ECBB的区别

OMAP3503ECBC

德州仪器

完全替代

OMAP3503DCBB和OMAP3503ECBC的区别

OMAP3515ECBB

德州仪器

完全替代

OMAP3503DCBB和OMAP3515ECBB的区别

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