SM320F2812GHHMEP

数字信号处理器 Digital Signal Processors

Introduction

This section provides a summary of each device’s features, lists the pin assignments, and describes the

function of each pin. This document also provides detailed descriptions of peripherals, electrical

specifications, parameter measurement information, and mechanical data about the available packaging.

Description

The SM320F2810-EP, SM320F2811-EP, SM320F2812-EP, SM320C2810-EP, SM320C2811-EP, and M320C2812-EP devices, members of the TMS320C28xDSP generation, are highly integrated, high-performance solutions for demanding control applications. The functional blocks and the memory maps are described in Section 3, Functional Overview.

Features

Controlled Baseline

− One Assembly/Test/Fabrication Site

Extended Temperature Performance of

−55°C to 125°C

Enhanced Diminishing Manufacturing Sources DMS Support

Enhanced Product-Change Notification

Qualification Pedigree†

High-Performance Static CMOS Technology

− 150 MHz 6.67-ns Cycle Time

− Low-Power 1.8-V Core @135 MHz, 1.9-V Core @150 MHz, 3.3-V I/O Design JTAG Boundary Scan Support‡

High-Performance 32-Bit CPU 320C28x

− 16 x 16 and 32 x 32 MAC Operations

− 16 x 16 Dual MAC

− Harvard Bus Architecture

− Atomic Operations

− Fast Interrupt Response and Processing

− Unified Memory Programming Model

− 4M Linear Program/Data Address Reach

− Code-Efficient in C/C++ and Assembly

− 320F24x/LF240x Processor Source Code Compatible

On-Chip Memory

− Flash Devices: Up to 128K x 16 Flash Four 8K x 16 and Six 16K x 16 Sectors

− ROM Devices: Up to 128K x 16 ROM

− 1K x 16 OTP ROM

− L0 and L1: 2 Blocks of 4K x 16 Each Single-Access RAM SARAM

− H0: 1 Block of 8K x 16 SARAM

− M0 and M1: 2 Blocks of 1K x 16 Each SARAM

Boot ROM 4K x 16

− With Software Boot Modes

− Standard Math Tables

External Interface 2812

− Up to 1M Total Memory

− Programmable Wait States

− Programmable Read/Write Strobe Timing

− Three Individual Chip Selects