SPC560P50L3CEFAY

SPC560P50L3CEFAY图片1
SPC560P50L3CEFAY概述

SPC560P50L3CEFAY 托盘

This 32-bit system-on-chip SoC automotive microcontroller family is the latest achievement in integrated automotive application controllers. It belongs to an expanding range of automotive-focused products designed to address chassis applications—specifically, electrical hydraulic power steering EHPS and electric power steering EPS—as well as airbag applications.

**Key Features**

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64 MHz, single issue, 32-bit CPU core complex e200z0h
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Compliant with Power Architecture® embedded category
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Variable Length Encoding VLE
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Memory organization
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Up to 512 KB on-chip code flash memory with ECC and erase/program controller
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Additional 64 4 × 16 KB on-chip data flash memory with ECC for EEPROM emulation
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Up to 40 KB on-chip SRAM with ECC
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Fail safe protection
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Programmable watchdog timer
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Non-maskable interrupt
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Fault collection unit
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Nexus L2+ interface
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Interrupts
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16-channel eDMA controller
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16 priority level controller
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General purpose I/Os individually programmable as input, output or special function
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2 general purpose eTimer units
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6 timers each with up/down count capabilities
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16-bit resolution, cascadable counters
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Quadrature decode with rotation direction flag
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Double buffer input capture and output compare
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Communications interfaces
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2 LINFlex channels LIN 2.1
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4 DSPI channels with automatic chip select generation
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1 FlexCAN interface 2.0B Active with 32 message objects
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1 safety port based on FlexCAN with 32 message objects and up to 7.5 Mbit/s capability; usable as second CAN when not used as safety port
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1 FlexRay™ module V2.1 with selectable dual or single channel support, 32 message objects and up to 10 Mbit/s 512 KB device only
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Two 10-bit analog-to-digital converters ADC
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2 × 11 input channels, + 4 shared channels
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Conversion time < 1 μs including sampling time at full precision
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Programmable ADC Cross Triggering Unit CTU
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4 analog watchdogs with interrupt capability
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On-chip CAN/UART bootstrap loader with Boot Assist Module BAM
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1 FlexPWM unit: 8 complementary or independent outputs with ADC synchronization signals
SPC560P50L3CEFAY中文资料参数规格
技术参数

RAM大小 40 KB

模数转换数ADC 2

工作温度Max 125 ℃

工作温度Min -40 ℃

封装参数

安装方式 Surface Mount

引脚数 100

封装 LQFP-100

外形尺寸

封装 LQFP-100

物理参数

工作温度 -40℃ ~ 125℃ TA

其他

产品生命周期 Active

包装方式 Tray

符合标准

RoHS标准 RoHS Compliant

含铅标准 无铅

海关信息

ECCN代码 3A991A2

数据手册

SPC560P50L3CEFAY引脚图与封装图
SPC560P50L3CEFAY电路图
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型号: SPC560P50L3CEFAY
描述:SPC560P50L3CEFAY 托盘
替代型号SPC560P50L3CEFAY
型号/品牌 代替类型 替代型号对比

SPC560P50L3CEFAY

ST Microelectronics 意法半导体

当前型号

当前型号

SPC5604PGF1MLL6

恩智浦

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SPC560P50L3CEFAY和SPC5604PGF1MLL6的区别

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