SP900S-0.009-00-54

BERGQUIST  SP900S-0.009-00-54  热绝缘, Sil-垫 900S, .009", TO-220, 10只, 1.6 W/m.K, 5.5 V, 0.229 mm, 10000 Mohm-m

The is a 0.009 x 5 x 4-inch no adhesive Sil-Pad® high performance thermally conductive Insulation Material which is designed for a wide variety of applications requiring high thermal performance and electrical isolation. These applications also typically have low mounting pressures for component clamping. Sil-Pad 900S material combines a smooth and highly compliant surface characteristic with high thermal conductivity. These features optimize the thermal resistance properties at low pressures. Applications requiring low component clamping forces include discrete semiconductors TO-220,TO-247 and TO-218 mounted with spring clips. Spring clips assist with quick assembly and apply a limited amount of force to the semiconductor. The smooth surface texture of Sil-Pad 900S minimizes interfacial thermal resistance and maximizes thermal performance.

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UL94V-0 Flammability rating

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Electrically isolating

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Low mounting pressures

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Smooth and highly compliant surface

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General-purpose thermal interface material solution

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-60 to 180°C Temperature range