SNJ54LVT244J

3.3 -V ABT八路缓冲器/驱动器，具有三态输出 3.3-V ABT OCTAL BUFFERS/DRIVERS WITH 3-STATE OUTPUTS

description

These octal buffers and line drivers are designed specifically for low-voltage 3.3-V VCCoperation, but with the capability to provide a TTL interface to a 5-V system environment.

The ’LVT244 is organized as two 4-bit line drivers with separate output-enable OE inputs. When OEis low, the device passes data from the A inputs to the Y outputs. When OEis high, the outputs are in the high-impedance state.

Active bus-hold circuitry is provided to hold unused or floating data inputs at a valid logic level.

To ensure the high-impedance state during power up or power down, OEshould be tied to VCC through a pullup resistor; the minimum value of the resistor is determined by the current-sinking capability of the driver.

The SN74LVT244 is packaged in ’s shrink small-outline package DB, which provides the same I/O pin count and functionality of standard small-outline packages in less than half the printed-circuit-board area.

The SN54LVT244 is characterized for operation over the full military temperature range of –55°C to 125°C. The SN74LVT244 is characterized for operation from –40°C to 85°C.

•State-of-the-Art Advanced BiCMOS Technology ABT Design for 3.3-V Operation and Low Static Power Dissipation

•Support Mixed-Mode Signal Operation 5-V Input and Output Voltages With 3.3-V VCC

•Support Unregulated Battery Operation Down to 2.7 V

•Typical VOLPOutput Ground Bounce < 0.8 V at VCC= 3.3 V, TA= 25°C

•ESD Protection Exceeds 2000 V Per MIL-STD-883C, Method 3015; Exceeds 200 V Using Machine Model C = 200 pF, R = 0

•Latch-Up Performance Exceeds 500 mA Per JEDEC Standard JESD-17

•Bus-Hold Data Inputs Eliminate the Need for External Pullup Resistors

•Supports Live Insertion

•Package Options Include Plastic Small-Outline DW, Shrink Small-Outline DB, and Thin Shrink Small-Outline PW Packages, Ceramic Chip Carriers FK, Ceramic Flatpacks W, and Ceramic

DIPS J