4mm 11 转密封 250mW TSM 4YL 系列小尺寸，具备最佳封装密度 专业等级 低接触电阻变化，稳定性出色 适用于手动和自动操作 完全密封，符合 IP67 汽相和回流焊接 在印迹剖面中提供Resistive Element | Cermet ---|--- Power Rating | 250mW at 85°C Limiting Element Voltage | 200V linear law Tolerance Standard | ±10% Temperature Coefficient | ±100ppm/°C Contact Resistance Variation | 1% or 3 ohms Electrical Travel | 11 turns ±2 Operating Torque | 1 Ncm max. Rotational Life Electrical & Mechanical | 100 cycles - rated power Soldering Temperature | Vapour phase 215°C/20 secs. Reflow: 230°C/20 secs.Do not exceed peak 260°C | | Operating Temperature Range | -55°C to +125°C Dimensions | W. 5.0 D.5.0 H. 3.7mm ### 多转贴片电容器
4mm 11 转密封 250mW TSM 4YL 系列
小尺寸，具备最佳封装密度
专业等级
低接触变化，稳定性出色
适用于手动和自动操作
完全密封，符合 IP67
汽相和回流焊接
在印迹剖面中提供
Resistive Element | Cermet
---|---
Power Rating | 250mW at 85°C
Limiting Element Voltage | 200V linear law
Tolerance Standard | ±10%
Temperature Coefficient | ±100ppm/°C
Contact Resistance Variation | 1% or 3 ohms
Electrical Travel | 11 turns ±2
Operating Torque | 1 Ncm max.
Rotational Life Electrical & Mechanical | 100 cycles - rated power
Soldering Temperature | Vapour phase 215°C/20 secs. Reflow: 230°C/20 secs.Do not exceed peak 260°C
|
|
Operating Temperature Range | -55°C to +125°C
Dimensions | W. 5.0 D.5.0 H. 3.7mm