TD330N16KOFTIMHPSA1

分立半导体模块 BOND MODULE

Summary of Features:

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Pressure contact technology for high reliability

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Industrial standard package

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Electrically insulated baseplate

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Short on fail

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Highest robustness

Benefits:

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Fail safe

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Preventing arcing on fail

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Easy mounting

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Fuseless design possible due to high overload capability

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UL recognized

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Simplify mounting

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Reduce process time in production

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Increase system reliability and lifetime

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Eliminate of thermal paste application process

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R thCH 20 % less