TT500N16KOFTIMHPSA1

TT500N16KOFTIMHPSA1图片1
TT500N16KOFTIMHPSA1概述

分立半导体模块 THYR / DIODE MODULE DK

Summary of Features:

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Pressure contact technology for high reliability
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Industrial standard package
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Electrically insulated baseplate
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Short on fail
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Highest robustness

Benefits:

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Fail safe
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Preventing arcing on fail
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Easy mounting
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Fuseless design possible due to high overload capability
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UL recognized
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Simplify mounting
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Reduce process time in production
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Increase system reliability and lifetime
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Eliminate of thermal paste application process
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R thCH 20 % less
TT500N16KOFTIMHPSA1中文资料参数规格
技术参数

保持电流Max 300 mA

工作温度Max 125 ℃

封装参数

引脚数 7

封装 BG-PB60AT-1

外形尺寸

封装 BG-PB60AT-1

物理参数

工作温度 -40℃ ~ 125℃

其他

产品生命周期 Active

包装方式 Tray

制造应用 Commercial and Agriculture Vehicles, Drives, Uninterruptible Power Supply UPS, Traction, Wind, Industrial Welding

符合标准

RoHS标准 RoHS Compliant

含铅标准 Lead Free

数据手册

TT500N16KOFTIMHPSA1引脚图与封装图
TT500N16KOFTIMHPSA1电路图
在线购买TT500N16KOFTIMHPSA1
型号: TT500N16KOFTIMHPSA1
描述:分立半导体模块 THYR / DIODE MODULE DK

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