Module; diode/thyristor; 1.8kV; 190A; BG-PB34SB-1; Ufmax:1.52V
Summary of Features:
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Solder bond technology
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Industrial standard package
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Electrically insulated base plate
Benefits:
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Cost effective solution for higher competitiveness
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Predictably high performance and lifetime due to 100% x-ray monitoring
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Solid base plate for fast and easy mounting
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One-stop-shop due to complete module technology portfolio