XC2C256-6FT256C

XC2C256-6FT256C图片1
XC2C256-6FT256C图片2
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XC2C256-6FT256C概述

XC2C256 6FT256C 磨码

* Optimized for 1.8V systems * Industry’s fastest low power CPLD * Densities from 32 to 512 macrocells * Industry’s best 0.18 micron CMOS CPLD * Optimized architecture for effective logic synthesis * Multi-voltage I/O operation — 1.5V to 3.3V * Advanced system features * Fastest in system programming · 1.8V ISP using IEEE 1532 JTAG interface * On-The-Fly Reconfiguration OTF * IEEE1149.1 JTAG Boundary Scan Test * Optional Schmitt trigger input per pin * Multiple I/O banks on all devices * Unsurpassed low power management · DataGATE external signal control * Flexible clocking modes · Optional DualEDGE triggered registers · Clock divider ÷ 2,4,6,8,10,12,14,16 · CoolCLOCK * Global signal options with macrocell control · Multiple global clocks with phase selection per macrocell · Multiple global output enables · Global set/reset * Abundant product term clocks, output enables and set/resets * Efficient control term clocks, output enables and set/resets for each macrocell and shared across function blocks * Advanced design security * Open-drain output option for Wired-OR and LED drive * Optional bus-hold, 3-state or weak pullup on select I/O pins * Optional configurable grounds on unused I/Os * Mixed I/O voltages compatible with 1.5V, 1.8V, 2.5V, and 3.3V logic levels on all parts * SSTL2_1,SSTL3_1, and HSTL_1 on 128 macrocell and denser devices * Hot pluggable * PLA architecture * Superior pinout retention * 100% product term routability across function block * Wide package availability including fine pitch: * Chip Scale Package CSP BGA, Fine Line BGA, TQFP, PQFP, VQFP, and QFN packages * Pb-free available for all packages * Design entry/verification using and industry standard CAE tools * Free software support for all densities using Xilinx® WebPACK™ tool * Industry leading nonvolatile 0.18 micron CMOS process * Guaranteed 1,000 program/erase cycles * Guaranteed 20 year data retention

XC2C256-6FT256C中文资料参数规格
技术参数

电源电压 1.8 V

封装参数

安装方式 Surface Mount

引脚数 256

封装 LBGA-256

外形尺寸

封装 LBGA-256

物理参数

工作温度 0℃ ~ 70℃ TA

其他

产品生命周期 Active

包装方式 Tray

符合标准

RoHS标准 Non-Compliant

含铅标准 Contains Lead

海关信息

ECCN代码 EAR99

数据手册

XC2C256-6FT256C引脚图与封装图
XC2C256-6FT256C引脚图
在线购买XC2C256-6FT256C
型号: XC2C256-6FT256C
制造商: Xilinx 赛灵思
描述:XC2C256 6FT256C 磨码
替代型号XC2C256-6FT256C
型号/品牌 代替类型 替代型号对比

XC2C256-6FT256C

Xilinx 赛灵思

当前型号

当前型号

XC2C256-7FTG256C

赛灵思

完全替代

XC2C256-6FT256C和XC2C256-7FTG256C的区别

XC2C256-7FTG256I

赛灵思

完全替代

XC2C256-6FT256C和XC2C256-7FTG256I的区别

XC2C256-7FT256C

赛灵思

完全替代

XC2C256-6FT256C和XC2C256-7FT256C的区别

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