0536470274

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0536470274概述

0.635毫米( 0.025 “ )间距SlimStack ™接头,表面贴装,双排, VerticalStacking , 8.00和14.00毫米( 0.315和0.551 ” )堆叠高地,无铅, 20 Circuitswith压纹带封面与包装 0.635mm .025" Pitch SlimStack™ Header, Surface Mount, Dual Row, VerticalStacking, 8.00 and 14.00mm .315 and .551" Stacking Heights, Lead-free, 20 Circuitswith Embossed Tape with Cover Packaging

位置


得捷:
CONN PLUG 20POS SMD GOLD


艾睿:
Use this board to board 0536470274 header connector from Molex where IDC ribbon cables are used. This PL connector&s;s 20 contacts that are made out of copper alloy and plated with gold over nickel. Its pitch is 0.635 mm. This is a 2-row connector. It has a straight body orientation. It has a plug type gender. It has a maximum voltage rating of 100 VAC. This device has a maximum current rating of 0.5 A/contact. This product will be shipped in tape and reel packaging so that components can be mounted effectively. It uses the solder termination method. This product is 13.22 mm long, 7 mm tall and 5.2 mm deep. 0536470274 is housed in brown polyphenylene sulfide. This connector has an operating temperature of -55 to 85 °C.


安富利:
Conn Board to Board PL 20 POS 0.635mm Solder ST SMD Embossed T/R


0536470274中文资料参数规格
技术参数

触点数 20

极性 Male

触点电镀 Gold

额定电压DC 100 V

额定电流 500 mA

排数 2

灼热丝测试标准 Non-Compliant

无卤素状态 Not Low Halogen

方向 Vertical

电路数 20

针脚数 20

拔插次数 50

额定电流Max 0.5A/触头

工作温度Max 105 ℃

工作温度Min -55 ℃

额定电压Max 100 V

接触电阻Max 70 mΩ

封装参数

安装方式 Surface Mount

封装 -

引脚间距 640 µm

外形尺寸

高度 7 mm

封装 -

引脚间距 640 µm

接插高度 10.0 mm, 16.0 mm

物理参数

外壳颜色 Brown

触点材质 Copper Alloy

工作温度 -55℃ ~ 85℃

其他

产品生命周期 Active

包装方式 Tape & Reel TR

符合标准

RoHS标准 RoHS Compliant

含铅标准 Lead Free

数据手册

在线购买0536470274
型号: 0536470274
制造商: Molex 莫仕
描述:0.635毫米( 0.025 “ )间距SlimStack ™接头,表面贴装,双排, VerticalStacking , 8.00和14.00毫米( 0.315和0.551 ” )堆叠高地,无铅, 20 Circuitswith压纹带封面与包装 0.635mm .025" Pitch SlimStack™ Header, Surface Mount, Dual Row, VerticalStacking, 8.00 and 14.00mm .315 and .551" Stacking Heights, Lead-free, 20 Circuitswith Embossed Tape with Cover Packaging

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