0.635毫米( 0.025 “ )间距SlimStack ™接头,表面贴装,双排, VerticalStacking , 10.00和16.00毫米( .394和.630 ” )堆叠高地,无铅, 30Circuits ,以压纹带封面与包装 0.635mm .025" Pitch SlimStack™ Header, Surface Mount, Dual Row, VerticalStacking, 10.00 and 16.00mm .394 and .630" Stacking Heights, Lead-free, 30Circuits, with Embossed Tape with Cover Packaging
30 位置 插头,外罩触点 表面贴装型 镀金
得捷:
CONN PLUG 30POS SMD GOLD
立创商城:
PIN:30 间距0.635mm 立贴