0444321801概述
3.00毫米（ 0.118 “ ）间距微飞度3.0 BMI ™接头，表面安装，双排，垂直，与PCB偏光PEG， 18电路，锡（Sn ）镀层 3.00mm .118" Pitch Micro-Fit 3.0 BMI™ Header, Surface Mount Compatible, Dual Row, Vertical, with PCB Polarizing Peg, 18 Circuits, Tin Sn Plating
Connector Header Through Hole 18 position 0.118" 3.00mm
得捷:
MICRO-FIT BMI VERT DR HDR PEGS
艾睿:
Conn HDR 18 POS 3mm Solder ST Thru-Hole Micro-Fit 3.0 BMI Tray