
3.00毫米( 0.118 “ )间距微飞度3.0 ™接头,表面贴装兼容,单列,直角,与PCB压接金属固定夹, 12电路, 0.76μm ( 30μ ”),金(Au )选择性电镀 3.00mm .118" Pitch Micro-Fit 3.0™ Header, Surface Mount Compatible, Single Row,Right Angle, with PCB Press-fit Metal Retention Clip, 12 Circuits, 0.76μm 30μ" Gold Au Selective Plating
针座 表面贴装,直角 12 位置 0.118"(3.00mm)
得捷:
CONN HEADER SMD R/A 12POS 3MM
安富利:
Conn Board to Board HDR 12 POS 3mm Solder RA SMD Embossed T/R