0444280803

3.00毫米（ 0.118 “ ）间距微飞度3.0 BMI ™接头，表面安装， DualRow ，直角，以管理单元塑料钉板锁，8个电路， 0.76μm （ 30μ ”），金（Au ）选择性电镀 3.00mm .118" Pitch Micro-Fit 3.0 BMI™ Header, Surface Mount Compatible, DualRow, Right Angle, with Snap-in Plastic Peg PCB Lock, 8 Circuits, 0.76μm 30μ" Gold Au Selective Plating

Connector Header Through Hole, Right Angle 8 position 0.118" 3.00mm

得捷:
CONN HEADER R/A 8POS 3MM

艾睿:
Conn 8 POS 3mm Solder RA Thru-Hole Micro-Fit 3.0 BMI Tray

安富利:
Conn Wire to Board HDR 8 POS 3mm Solder RA Thru-Hole Tray