3.00毫米（ 0.118 “ ）间距微飞度3.0 ™线对板头，双排，垂直长达3.56毫米（ 0.140 ” ）厚的PCB ， 24电路， 0.38μm （ 15μ “），金（Au ）选择性电镀 3.00mm .118" Pitch Micro-Fit 3.0™ Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm .140" Thick PCB, 24 Circuits, 0.38μm 15μ" Gold Au Selective Plating
Connector Header Through Hole 24 position 0.118" 3.00mm
得捷:
CONN HEADER VERT 24POS 3MM
艾睿:
Conn Power HDR 24 POS 3mm Solder ST Thru-Hole Micro-Fit 3.0 Tray
安富利:
Conn Wire to Board HDR 24 POS 3mm Solder ST Thru-Hole Tray