3M 200-6313-9UN-1900 芯片和元件插座, PGA插座, 169 触点, 镀金触芯
The is a Test and Burn-in PGA Socket Kit without contacts, 13 x 13 matrix size. This socket is polyethersyfone PES insulated that provides individual components ready for assembly and used when only a few test sockets are needed. This is open pattern top plate; hence load only those contacts needed for your specific device pin pattern.