多层陶瓷电容器, 表面贴装, 0.15 µF, 630 V, 1812 [4532 公制], ± 10%, X7R, AEC-Q200 X系列FT-CAP
KEMET"s Automotive Grade High Voltage Surface Mount MLCCs with Flexible Termination HV FT-CAP address the primary failure mode of MLCCs - flex cracks, which are typically the result of excessive tensile and shear stresses produced during board flexure and thermal cycling. Featuring several of the highest CV capacitance/voltage values available in the industry, these devices utilize a pliable and conductive silver epoxy between the base metal and nickel barrier layers of the termination system. The addition of this epoxy layer inhibits the transfer of board stress to the rigid ceramic body, therefore mitigating flex cracks which can result in low IR or short circuit failures. Although flexible termination technology does not eliminate the potential for mechanical damage that may propagate during extreme environmental and handling conditions, it does provide superior flex performance over standard termination systems.
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C1812X154KBRACAUTO KEMET Corporation 基美 | 当前型号 | 当前型号 |
C1812W154KBRACAUTO 基美 | 功能相似 | C1812X154KBRACAUTO和C1812W154KBRACAUTO的区别 |