晶体管, IGBT阵列&模块, N沟道, 37 A, 1.55 V, 115 W, 600 V, Module
Summary of Features:
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Low Switching Losses
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Trench IGBT 3
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VCEsat with positive Temperature Coefficient
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Low VCEsat
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Al2O3 Substrate with Low Thermal Resistance
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Compact Design
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Solder Contact Technology
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Rugged mounting due to integrated mounting clamps
Benefits:
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Compact module concept
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Optimized customer’s development cycle time and cost
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Configuration flexibility