374024B00035G

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374024B00035G概述

AAVID THERMALLOY  374024B00035G  散热器, 方形, 电路板, 用于球栅阵列, BGA, 40 °C/W, 10 mm, 23 mm, 23 mm

The is a 10 x 23 x 23mm pin fin Heat Sink with tape attachment. This heat sink is made of aluminium and due its tape mounting it saves board space by eliminating mounting holes, convenient peel and stick assembly is quick and clean. The pin fin array allows omnidirectional airflow to maximize heat dissipation.


贸泽:
Heat Sinks 23mm X 10mm ADV MNT


e络盟:
散热器, 方形, 电路板, 用于球栅阵列, 40 °C/W, BGA, 23 mm, 10 mm, 23 mm


艾睿:
Heat Sink Passive BGA Pin Array Adhesive 40


安富利:
Heat Sink Passive BGA Pin Array Tape 40°C/W Black Anodized


Chip1Stop:
Heat Sink Passive BGA Pin Array Tape 40ÂÂ℃/W Black Anodized


Verical:
Heat Sink Passive BGA Pin Array Adhesive Aluminum 40C/W Black Anodized


Newark:
# AAVID THERMALLOY  374024B00035G  Heat Sink, Square, PCB, For Ball Grid Arrays, BGA, 40 °C/W, 10 mm, 23 mm, 23 mm


374024B00035G中文资料参数规格
技术参数

热阻 40 ℃/W

封装参数

安装方式 Surface Mount

封装 BGA

外形尺寸

长度 23 mm

宽度 23 mm

高度 10 mm

封装 BGA

物理参数

颜色 Black

材质 Aluminum

其他

产品生命周期 Active

包装方式 Tray

制造应用 Consumer Electronics, Industrial, 消费电子产品, 工业

符合标准

RoHS标准 RoHS Compliant

含铅标准 Lead Free

REACH SVHC标准 No SVHC

REACH SVHC版本 2015/12/17

数据手册

在线购买374024B00035G
型号: 374024B00035G
描述:AAVID THERMALLOY  374024B00035G  散热器, 方形, 电路板, 用于球栅阵列, BGA, 40 °C/W, 10 mm, 23 mm, 23 mm

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