371824B00032G

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371824B00032G概述

散热片 Heatsink for Metal/Ceramic BGA Packages, Black Anodized, 35x35x7mm, IC Pkg Size = 35 x 35, Tape #32

**BGA Heatsink, Tape mounting**

A range of BGA heatsinks with thermally conductive adhesive tape mounting.


贸泽:
散热片 Heatsink for Metal/Ceramic BGA Packages, Black Anodized, 35x35x7mm, IC Pkg Size = 35 x 35, Tape #32


艾睿:
Heat Sink Passive BGA Pin Array Adhesive Aluminum Black Anodized


Allied Electronics:
Heatsink, Metal/Ceramic BGA Packages, 31.9degC/W, 35 x 35 x 7mm, Surface Mount


Chip1Stop:
Heat Sink Passive BGA Pin Array Adhesive Black Anodized


Verical:
Heat Sink Passive BGA/FPGA Pin Array Adhesive Aluminum 31.9C/W Black Anodized


Newark:
# AAVID THERMALLOY  371824B00032G  Heat Sink, Square, PCB, For Ball Grid Arrays, BGA, 31.9 °C/W, 7 mm, 35 mm, 35 mm


371824B00032G中文资料参数规格
技术参数

热阻 31.9 ℃/W

封装参数

安装方式 Surface Mount

封装 BGA

外形尺寸

长度 35 mm

宽度 35 mm

高度 7 mm

封装 BGA

物理参数

颜色 Black

材质 Aluminum

其他

产品生命周期 Active

包装方式 Tray

符合标准

RoHS标准 RoHS Compliant

含铅标准 Lead Free

REACH SVHC版本 2015/12/17

数据手册

在线购买371824B00032G
型号: 371824B00032G
描述:散热片 Heatsink for Metal/Ceramic BGA Packages, Black Anodized, 35x35x7mm, IC Pkg Size = 35 x 35, Tape #32

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