374724B60024G

AAVID THERMALLOY  374724B60024G  散热器, 用于球栅阵列, BGA, 15.3 °C/W, 18 mm, 35 mm, 35 mm

The is a silver solder-anchor Heat Sink for use with FPGA/BGA packages. It is made of aluminium with black anodize finish.

.

Solder anchors provide the most rugged mounting in the industry

.

Simple tool-free installation

.

Minimal PC board real estate is required for mounting

.

Lip design allows for easy removal in case of rework

.

Pin-fin array allows omnidirectional airflow to maximize heat dissipation

.

Comes with T766 chomerics phase change for all surfaces

Requires two anchors.