374324B00035G

AAVID THERMALLOY  374324B00035G  散热器, 方形, 电路板, 用于球栅阵列, BGA, 30.6 °C/W, 10 mm, 27 mm, 27 mm

* Tape mounting saves board space by eliminating mounting holes

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Convenient peel and stick assembly is quick and clean

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Pin-Fin array allows omni-directional airflow to maximize heat dissipation

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Fin dimensions LxW: 13x12mm

e络盟:
散热器, 方形, 电路板, 用于球栅阵列, 30.6 °C/W, BGA, 27 mm, 10 mm, 27 mm

艾睿:
Heat Sink Passive BGA/FPGA Pin Array Adhesive Aluminum 30.6°C/W Black Anodized

安富利:
Heat Sink Passive BGA Pin Array Adhesive 30.6°C/W Black Anodized

富昌:
Heat Sink Passive BGA Pin Array Adhesive 30.6C/W Black Anodized 27 x 27 x 10 mm

Chip1Stop:
Heat Sink Passive BGA Pin Array Adhesive 30.6ÂÂ℃/W Black Anodized

Verical:
Heat Sink Passive BGA/FPGA Pin Array Adhesive Aluminum 30.6C/W Black Anodized

Newark:
# AAVID THERMALLOY  374324B00035G  Heat Sink, Square, PCB, For Ball Grid Arrays, BGA, 30.6 °C/W, 10 mm, 27 mm, 27 mm