AAVID THERMALLOY 374124B00035G 散热器, 方形, 电路板, 用于球栅阵列, BGA, 23.4 °C/W, 18 mm, 23 mm, 23 mm
The is a clear/silver pin-fin Heat Sink with tape attachment suitable for FPGA/BGA packages. It is made of aluminium with black anodize finish.
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Tape mounting saves board space by eliminating mounting holes
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Convenient peel and stick assembly is quick and clean
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Pin-fin array allows omnidirectional airflow to maximize heat dissipation
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Comes with T411 Chomerics tape for all surfaces
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Silicone adhesive