374724B00032G概述
BGA 15.3 °C/W 热阻 35 x 35 x 18 mm 黑色阳极氧化 散热片
The is a white pin-fin Heat Sink with tape attachment suitable for FPGA/BGA packages. It is made of aluminium with black anodize finish.
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- Tape mounting saves board space by eliminating mounting holes
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- Convenient peel and stick assembly is quick and clean
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- Pin-fin array allows omnidirectional airflow to maximize heat dissipation
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- Comes with T405R Chomerics tape for metal surface
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- Acrylic adhesive
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