374424B00035G

AAVID THERMALLOY  374424B00035G  散热器, 方形, 电路板, 用于球栅阵列, BGA, 20.3 °C/W, 18 mm, 27 mm, 27 mm

* Tape mounting saves board space by eliminating mounting holes

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Convenient peel and stick assembly is quick and clean

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Pin-Fin array allows omni-directional airflow to maximize heat dissipation

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Fin dimensions LxW: 8x8mm

欧时:
BGA 散热器，胶带安装BGA 散热器系列，采用热导电粘合剂磁带安装。胶带安装通过取消安装孔节省板上空间 便利的脱皮和粘贴是快速和干净的。 引脚散热片阵列允许通过全向气流取得最佳散热效果### BGA 散热器

e络盟:
散热器, 方形, 电路板, 用于球栅阵列, 20.3 °C/W, BGA, 27 mm, 18 mm, 27 mm

Allied Electronics:
Heatsink, BGA, 20.3K/W, 27 x 27 x 18mm, Adhesive Foil Mount

Chip1Stop:
Heat Sink Passive BGA Pin Array Tape Plastic Black Anodized

Verical:
Heat Sink Passive BGA/FPGA Pin Array Adhesive Aluminum 20.3C/W Black Anodized

Newark:
# AAVID THERMALLOY  374424B00035G  Heat Sink, Square, PCB, For Ball Grid Arrays, BGA, 20.3 C/W, 18 mm, 27 mm, 27 mm