WAKEFIELD SOLUTIONS 303N 散热器
散热片 螺栓安装式半导体外壳 铝合金 15.0W @ 37°C 插件板级，垂直
得捷:
HEATSINK COMPACT
贸泽:
散热片 Compact Heatsink for Dual Stud-Mounted Semiconductor Cases, 50.8x50.8x76.2mm, 1 1 4 -28UNF, 0.625 Inch Thread Depth
e络盟:
散热器, 铝质, 黑色, 2.000H x 2.000W
Allied Electronics:
Compact Heat Sink for Dual StudMounted Semiconductor Cases
Verical:
Heat Sink Passive Stud Mount Aluminum Alloy 1.3C/W Black Anodized
Newark:
# WAKEFIELD SOLUTIONS 303N Heat Sink, Extruded, For Power Semiconductors, 2.47 °C/W, 76.2 mm, 50.8 mm, 76.2 mm
MASTER:
Heat Sink Passive Stud Mount Aluminum Alloy 1.3°C/W Black Anodized
Online Components:
Heat Sink Passive Stud Mount Aluminum Alloy 1.3°C/W Black Anodized
Electro Sonic:
Heat Sink Passive Stud Mount Aluminum Alloy 1.3°C/W Black Anodized