3B30-02

3B30-02概述

隔离电压输入 Isolated Voltage Input

Product Details

The 3B Series Signal Conditioning I/O Subsystem provides a low cost, versatile method of interconnecting real world analog signals to a data acquisition, monitoring or control system. It is designed to interface directly to analog signals such as thermocouple, RTD, ac and dc Strain Gage, Torque Transducer, Frequency, LVDT, AD590/AC2626 solid state temperature sensor outputs, and millivolt or process current signals, and convert the inputs to standardized analog outputs compatible with high level analog I/O subsystems.

The 3B Series Subsystem consists of a 19" relay rack, compatible universal mounting backplane and a family of plug-in input and output signal conditioning modules up to 16 per rack. 8- and 4-channel backplanes are also available. Each backplane incorporates screw terminals for sensor inputs and current outputs and a connector for high level, single-ended outputs to the user’s equipment.

Input and output modules are offered in both isolated ±1500 V peak and nonisolated versions. The input modules feature complete signal conditioning circuitry optimized for specific sensors or analog signals, and provide high level analog outputs. Each input module provides two simultaneous outputs: 0 V to +10 V or ±10 V and 4–20 mA or 0–20 mA. Output modules accept 0 V to +10 V or ±10 V single ended signals and provide an isolated or nonisolated 4–20 mA or 0–20 mA process signal. All modules feature a universal pinout and may be readily “mixed and matched” and interchanged without disrupting field wiring.

Each backplane contains the provision for a subsystem power supply. The 3B Series Subsystem can operate either from a common dc/dc or ac power supply mounted on each backplane, or from externally provided dc power. Two LEDs are used to indicate that power is being applied.

### Features and Benefits

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Accepts mV Input
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Current Sense Applications
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General Purpose Isolation
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3 Hz BW
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Voltage ± 10V and Current Outputs 0-20mA or 4-20mA
3B30-02中文资料参数规格
技术参数

工作温度Max 85 ℃

工作温度Min -25 ℃

封装参数

引脚数 30

封装 IOS MODULE

外形尺寸

高度 86.2 mm

封装 IOS MODULE

其他

产品生命周期 Active

包装方式 Tray

符合标准

RoHS标准 Non-Compliant

含铅标准 Contains Lead

数据手册

3B30-02引脚图与封装图
3B30-02电路图
在线购买3B30-02
型号: 3B30-02
制造商: ADI 亚德诺
描述:隔离电压输入 Isolated Voltage Input

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