3403.0165.24

Fuse Chip Slow Blow Acting 0.8A 250V SMD Solder Pad 10.1 X 3mm Ceramic T/R

IEC Standard Universal Modular Fuse UMF in time-lag UMT or fast-acting UMF characteristics. Ceramic housing. 300 A and 250/277 VAC breaking capacity.

**Features:**

* Directly Solderable on Printed Circuit Boards

* Low Melting I2t Values, Fast Interruption

* Materials: Ceramic Housing. Supplied in 100-Piece Bags. Also Available on a 2000-Piece Reel

**Applications:**

* Primary Protection on SMD PCB

* Secondary Protection on DC and AC

* Industrial Electronic

* Medical Equipments

* Power Supplies