Res Thick Film NET 6.8KΩ 2% 1.25W ±100ppm/℃ BUS Molded 10Pin SIP Pin Thru-Hole
6.8k Ohm ±2% 200mW Power Per Element Bussed Resistor Network/Array ±100ppm/°C 10-SIP
艾睿:
Res Thick Film NET 6.8K Ohm 2% 1.25W ±100ppm/°C BUS Molded 10-Pin SIP Pin Thru-Hole
Allied Electronics:
RNET - THK FILM MOLD SIP
安富利:
Res Thick Film NET 6.8K Ohm 2% 1.25W ±100ppm/°C BUS Molded 10-Pin SIP Pin Thru-Hole
Chip1Stop:
Res Thick Film NET 6.8K Ohm 2% 1.25W ±100ppm/℃ BUS Molded 10-Pin SIP Pin Thru-Hole
Verical:
Res Thick Film NET 6.8K Ohm 2% 1.25W ±100ppm/C BUS Molded 10-Pin SIP Pin Thru-Hole
MASTER:
Res Thick Film NET 6.8K Ohm 2% 1.25W ±100ppm/°C BUS Molded 10-Pin SIP Pin Thru-Hole
Electro Sonic:
Res Thick Film NET 6.8K Ohm 2% 1.25W ±100ppm/°C BUS Molded 10-Pin SIP Pin Thru-Hole
触点数 10
额定电压DC 100 V
容差 ±2 %
额定功率 1.25 W
电阻 6.8 kΩ
阻值偏差 ±2 %
工作温度Max 125 ℃
工作温度Min -55 ℃
安装方式 Through Hole
引脚数 10
封装 SIP-10
长度 24.99 mm
宽度 2.16 mm
高度 4.95 mm
封装 SIP-10
厚度 2.16 mm
工作温度 -55℃ ~ 125℃
温度系数 ±100 ppm/℃
产品生命周期 Active
包装方式 Bulk
制造应用 -
RoHS标准 RoHS Compliant
含铅标准 Lead Free
ECCN代码 EAR99
HTS代码 8533210050