3.00毫米( 0.118 “ )间距微飞度3.0 ™插座外壳,单列, 9电路 3.00mm .118" Pitch Micro-Fit 3.0™ Receptacle Housing, Single Row, 9 Circuits
Micro-Fit 3.0™ Connectors
Micro-Fit 3.0™ Connectors are a 3.00mm pitch high-density, low-power connector system available in wire-to-wire and wire-to-board configurations with SMT and through-hole options and up to 5.0A to meet low- to mid-range power application needs. ’s Micro-Fit 3.0 Interconnects offer users a low- to mid-range power-distribution solution with the highest current in the smallest footprint available today. Based on a 3.0mm centerline Micro-Fit 3.0 is available in wire-to-wire and wire-to-board configurations, SMT and through-hole processing, 2 to 24 circuits and single- and dual-row versions. Micro-Fit 3.0 Connectors can be purchased in pure tin or one of two thicknesses of select gold to provide costs savings. Contacts are fully isolated on each side of the interface to eliminate potential arcing and incorporate four points of contact for redundancy. The housings utilize positive-lock features to prevent accidental disconnects. Micro-Fit 3.0 Interconnects are UL recognized, CSA approved and TUV licensed. All components are leadfree, RoHS compliant, halogen free and glow wire capable.
触点数 9
极性 Female
排数 1
灼热丝测试标准 Non-Compliant
无卤素状态 Not Low Halogen
电路数 9
针脚数 9
额定电流Max 5A/触头
工作温度Max 105 ℃
工作温度Min -40 ℃
引脚间距 3.00 mm
长度 27.85 mm
宽度 14 mm
高度 14 mm
引脚间距 3.00 mm
外壳颜色 Black
颜色 Black
工作温度 -40℃ ~ 105℃
外壳材质 Polyester
产品生命周期 Active
包装方式 Bulk
RoHS标准 RoHS Compliant
含铅标准 Lead Free
REACH SVHC标准 No SVHC