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The is a 10 x 8 x 22.86mm surface mount Heat Sink made of copper with tin plated finish. This heat sink features horizontal mount orientation and is suitable for use with D-Pak TO-252 device. This non-electronic component is functionally unaffected by the normal soldering or reflow processes used for semiconductor circuits. The heat resistance time or heat resistance temperature is not applicable for the component. The elevated "Wings" of the heat sink provide ample surface area to dissipate the heat into the surrounding environment.
热阻 15 ℃/W
热阻强制气流 12.5℃/W @600LFM
安装方式 Surface Mount
封装 TO-252
长度 8.00 mm
宽度 22.86 mm
高度 10.16 mm
封装 TO-252
颜色 Tin
材质 Copper
产品生命周期 Active
包装方式 Tape & Reel TR
制造应用 工业, Industrial, Communications & Networking, 通信与网络, Motor Drive & Control, 电机驱动与控制, 消费电子产品, Consumer Electronics
RoHS标准 RoHS Compliant
含铅标准 Lead Free
REACH SVHC标准 No SVHC
REACH SVHC版本 2015/12/17
ECCN代码 EAR99

