AAVID THERMALLOY 573300D00010G 散热器, 方形, 电路板, 用于D Pak设备, TO-263, 18 °C/W, 10.16 mm, 12.7 mm, 26.16 mm
The is a 26.16mm surface mount Heat Sink with copper construction, tin-plated finish, 18°C/W thermal resistance. This heat sink non-electronic component is functionally unaffected by the normal soldering or reflow processes used for semiconductor circuits. The heat resistance time or heat resistance temperature is not applicable for the component. It features no attachment holes required in the printed circuit board, 100% matte tin plating with nickel underplate, wing configuration will not interfere with adjacent components, their unique design removes heat indirectly through conduction without making contact with the SMT device like traditional through hole solutions. Compatible with both tin-lead and lead free Sn/Ag/Cu solders. Suitable for power supplies, telecommunication equipment, motor Controls, medical equipment, industrial process control equipment and consumer products applications.
耗散功率 1.25 W
热阻 18 ℃/W
热阻强制气流 10.0℃/W @200LFM
安装方式 Surface Mount
封装 TO-263
长度 12.70 mm
宽度 12.7 mm
高度 10.16 mm
封装 TO-263
颜色 Tin
材质 Copper
产品生命周期 Active
包装方式 Tape & Reel TR
制造应用 工业, 医用, Industrial, Communications & Networking, 电源管理, Power Management, 通信与网络, Motor Drive & Control, 电机驱动与控制, 消费电子产品, Consumer Electronics, Medical
RoHS标准 RoHS Compliant
含铅标准 Lead Free
REACH SVHC标准 No SVHC
REACH SVHC版本 2015/12/17
ECCN代码 EAR99